ULTRAVIOLET Ozone Cleaning Systems
UV/Ozone cleaning provides a fast, effective method for removing organic contaminants and preparing ultra-clean surfaces for demanding applications. Using ultraviolet light and ozone, these systems clean and activate surfaces without abrasive processing, making them ideal for R&D, semiconductor, electronics, optics, aerospace, engineering, and precision component cleaning.
UV/Ozone treatment is commonly used for substrate cleaning, computer chips, circuit boards, electronic components, optical materials, and other critical surfaces where cleanliness and surface preparation are essential. Ultra-clean surfaces can typically be achieved in just minutes following conventional cleaning, helping improve adhesion for thin-film deposition, coatings, bonding, and other downstream processes.
Key features
Ultra clean surfaces
Room temperature
Less than 10 minutes
Easy processing
Modest initial price
Modest initial price
minimal Operation cost
minimal Operation cost
Long-term reliability
Long-term reliability
International shipping
International shipping
Frequently Asked Questions
What does UV / Ozone cleaning remove?
| Solder flux | Residual photoresist |
| Condensed adhesive volatiles | Carbon traces |
| Human skin oils | Most organic contaminants |
How clean is “ultra” clean?
Contact angle measurements of 4-5 degrees. Miniscule peaks when measured with AES and ESCA. With steam test there are uniform rainbow-like fringes during condensation and evaporation. Often, cleaning of critical surfaces prior to other processing steps is considered finished after the usual scrubbing and ultrasoneration steps. UV/Ozone cleaning adds a valuable new dimension to cleaning that can prove itself in dollars and cents in improved performance and reliability in applications where UV/Ozone can be used after the standard cleaning operation.
How does UV / Ozone cleaning work?
What are some applications for UV / Ozone cleaning?
- Prior to thin film deposition on many surfaces
- CD/DVD masters
- Hybrid Substrates prior to wire bonding – removal of condensed epoxy volatiles
- Improved adhesion to plastic surfaces
- GaAs and InP wafers
- Optical lenses
- Creating Thin Oxide on Silicon wafers
- Silicon Wafers
- OLEDs
- Numerous other uses
