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The UV/Ozone cleaning process provides a simple inexpensive, fast method of obtaining ultra-clean surfaces free of organic contaminants. The process is ideal when thin film deposition with excellent adhesion to the surface is required. Ultra-clean surfaces can easily be achieved by UV/Ozone processing in one to several minutes after the surface has been cleaned by conventional techniques. UV/Ozone Cleaning Removes Traces of: Solder flux, residual photoresist, condensed adhesive volatiles, carbon traces, and most organic contaminants. How Clean is "ultra" clean? Contact angle measurements of 4-5 degrees. Miniscule peaks when measured with AES and ESCA. With steam test, there are uniform rainbow-like fringes during condensation and evaporation. Often, cleaning of critical surfaces prior to other processing steps is considered finished after the usual scrubbing and ultrasoneration steps. Ultra-violet/ozone cleaning adds a new dimension to cleaning... a valuable new dimension that can prove itself in dollars and cents in improved performance and reliability in applications where UV/Ozone can be used after the standard cleaning operation. How does UV/OZONE work? The heart of UVOCS cleaning equipment is a low pressure quartz mercury vapor lamp which generates UV emmissions in the 254 and 185 nanometer range. Ozone and atomic oxygen are generated. Organic contaminant molecules are excited or dissociated by the absorption of the 254 nm wavelength UV. The excited organic contaminants react with the atomic oxygen to form volatile products, such as CO2, H2O, etc. The whole process takes place at essentially room temperature in one to several minutes. * *The temperature rise of parts being cleaned is dependent on the length of processing time. APPLICATIONS FOR ULTRA CLEANING WITH UV/OZONE |